POSITION:Products & Technologies>R & D capability
As a national high-tech enterprise, Eastech Group has obtained 14 patents of various kinds, and established 5G R&D innovation center to actively research and develop advanced manufacturing capabilities for 5G high-frequency products.
Eastech Group already has 1-30 layers of manufacturing technology,It is committed to manufacturing high precision multilayer circuit boards, HDI circuit boards and other products, and has rich production experience in Thick board, Thin board, Heavy copper, Mixed laminating, high frequency and large size board. We can meet the customized production requirements of all kinds of products.
The mass production is similar to 16 layers and above (two pictures are attached), with three different cores. The two sides of the cores are different in copper thickness, thin external copper, and 0.165mm distance from the inner hole to the copper circuit. The core manufacturing technology patent has been locked exclusively.
POSITION:PRODUCTS>R & D capability