当前位置：产品与技术>工艺能力
| Serial | Item | Standard (Mass production) | Advanced (Prototype) |
|---|---|---|---|
| 1 | Layers Counts | 1- 20 Layers | 20-30 Layers |
| 2 | Available Laminates Material | FR-4 (Standard TG, Tg 150, High Tg 170, High Tg 180,High Tg 200, High CTI>=600, Halogen Free, High Frequency) , CEM-1, CEM-3, Metal Base(Aluminum base, Copper base) | |
| 3 | Material supplier | KB, SHENGYI, ITEQ, NANYA, VENTEC, ISOLA, EMC, Rogers | Arlon, Taconic, Nelco |
| 4 | Min Board Thickness | 0.20mm (8mil) | 0.15mm (6mil) |
| 5 | Max Board Thickness | 3.20mm (126mil) | 6.50mm (255.91mil) |
| 6 | Max Board Size | 1 Layer : 1500*500mm (59.055*19.685inches) | 1 Layer : 1500*500mm (59.055*19.685inches) |
2 Layers : 1500*500mm (59.055*19.685inches) | 2 Layers : 1500*500mm (59.055*19.685inches) | ||
≧4 Layers : 630*620mm (24.803*24.409inches) | ≧4 Layers 1400*610mm (55.118*24.015inches) | ||
| 7 | Finished copper thickness | 18-210um(1/2 oz-6 oz) | Max: 245um(7 oz) |
| 8 | Min Trace Width | 0.076mm (3mil) | 0.064mm(2.50mil) |
| 9 | Min Trace Spacing | 0.076mm (3mil) | 0.064mm(2.50mil) |
| 10 | Min Hole Diameter (Mechanical drill) | 0.15mm(6mil) | 0.15mm(6mil) |
| 11 | Min Hole Diameter (Laser drill) | 0.076mm(3mil) | 0.076mm(3mil) |
| 12 | Min PTH diameter tolerance | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
| 13 | Min NPTH diameter tolerance | ±0.05mm(±2mil) | ±0.038mm(±1.5mil) |
| 14 | Min Hole Position tolerance | ±0.05mm(±2mil) | ±0.05mm(±2mil) |
| 15 | Min PTH To Copper | 0.127mm(5mil) | 0.127mm(5mil) |
| 16 | BGA PItch with 1 Trace between Pads | 0.40mm(16mil) | 0.40mm(16mil) |
| 17 | Outerline Tolerance | ±0.075mm(±3mil) | ±0.075mm(±3mil) |
| 18 | Max Aspect ratio | 10 : 1 | 10 : 1 |
| 19 | Min Solder resist bridge | 0.064mm(2.5mil) | 0.064mm(2.5mil) |
| 20 | Impedance control tolerance | ±10% | ±8% |
| 21 | Solder mask color | LPI Green, White, Black, Blue, Red, Yellow(Matte or Gross) | |
| 22 | Silkscreen color | White, Black, Yellow, Blue, Red. | |
| 23 | Surface finished | Lead Free HASL, OSP, ENIG, Immersion Silver, Immersion Tin, Selective ENIG+OSP, Gold finger, Hard gold plating. | |
| 24 | HDI PCB stack up | 1+N+1, 2+N+2, 1+1+N+1+1 ,ELIC. | |
| 25 | Special Techniques | Carbon Mask, Peelable Mask. | |
| Kapton Tape | |||
| Countersink / Counterbore Hole | |||
| Half-cut Hole | |||
| Press Fit Hole | |||
| Controlled Depth Drilling / Back Drilling | |||
| Controlled Depth Routing | |||
| Edge Plating | |||
| Chamfering | |||
| Via in Pad | |||
| POFV (Plate-over-filled-via) | |||
| Solid Copper Filled Laser Vias | |||
| Serial | Item | Flex PCB | Rigid-Flex PCB | |
|---|---|---|---|---|
| 1 | Layers Counts | 1- 12 Layers | 2-16 Layers | |
| 2 | Material Type | PI, PET, kapton | PI+FR-4 | |
| 3 | Material Brand | SHENGYI, TAIFLEX, ITEQ, DuPont | ||
| 4 | Stiffener Material Type | FR-4, PI, PET, Steel, Al, Adhesive Tape | ||
| 5 | Min Board Thickness | 1 Layer | 0.05mm(2mil) | |
| 2 Layers | 0.10mm(4mil) | 0.20mm(8mil) | ||
| 6 | Max Board dimension | 250*1000mm (9.84*39.37 inches) | ||
| 7 | Min Trace Width / Trace Spacing | Copper thickness: 0.5 oz | 0.05/0.05mm(2/2mil) | |
| Copper thickness: 0.5 oz-1oz | 0.075/0.075mm(3/3mil) | |||
| Copper thickness: 1oz | 0.10/0.10mm(4/4mil) | |||
| 8 | Min Hole Diameter (Mechanical drill) | 0.15mm(6mil) | ||
| 9 | Min Hole Diameter (Laser drill) | 0.10mm(4mil) | ||
| 10 | Min Annular Rin (Outer layers) | 1 Layer | 0.10mm(4mil) | |
| 2 Layers | 0.10mm(4mil) | |||
| 11 | Min Annular Ring (Inner layers) | ≧ 4Layers | 0.10mm(4mil) | |
| Min Annular Ring (Outer layers) | 0.10mm(4mil) | |||
| 12 | Coverlay thickness | 12.5um, 25um, 50um | ||
| 13 | Min Coverlay Opening | 0.40*0.40mm(16*16mil) | ||
| 14 | Min Solder mask Opening | 0.15mm(6mil) | ||
| 15 | Min Coverlay Bridge | 0.20mm(4mil) | ||
| Min Solder mask Bridge | 0.13mm(5mil) | |||
| 16 | Via Type | Through Hole, Blind, Buried | ||
| 17 | Tolerance | PTH Hole | ±0.075mm(±3mil) | |
| NPTH Hole | ±0.05mm(±2mil) | |||
| Outline | ±0.10mm(±4mil) | |||
| Outside edge to Circuit | ±0.10mm(±4mil) | |||
| 20 | Surface finished | ENIG, OSP, Immersion Silver, Immersion Tin, Glod Plating, Gold Plating+ENIG, Gold Plating+OSP | ||
POSITION：PRODUCTS>R & D capability