Circuit board industry standards are many, and commonly used printed circuit board standards you know how much?
This paper lists some common printed circuit board standards for your reference.
IPC-ESD-2020
Joint standard for electrostatic discharge control program development.Including the necessary design, establishment, implementation and maintenance of electrostatic discharge control program.Based on the historical experience of some military and commercial organizations, this paper provides guidance for electrostatic discharge treatment and protection during sensitive periods.
IPC-SA-61A
After welding half water into the cleaning manual.Includes all aspects of semi-aqueous cleaning, including chemical, production residues, equipment, process, process control, and environmental and safety considerations.
IPC-AC-62A
After welding water into cleaning manual.Describe the manufacture of residues, types and properties of hydrophobic cleaners, hydrophobic cleaning processes, equipment and processes, quality control, environmental control and the measurement and cost of employee safety and cleanliness.
IPC-DRM-40E
Through hole welding spot assessment table - top reference manual.Detailed description of components, hole walls, and welding surfaces as required, in addition to computer-generated 3D graphics.It covers tin filling, contact Angle, tin sticking, vertical filling, pad covering and a large number of weld point defects.
IPC-TA-722
Welding technique evaluation manual.Includes 45 articles on various aspects of welding technology, including general welding, welding materials, manual welding, batch welding, wave peak welding, reflow welding, gas phase welding and infrared welding.
IPC-7525
Template design guide.Provide guidelines for the design and manufacture of solder paste and surface mount binder coated templates. I also discuss the design of templates using surface mount technology.Kunhe technology, including overprint, double print and stage template design.
IPC/EIAJ-STD-004
Flux specification requirement I includes appendix I.Technical indicators and classification including rosin, resin, organic and inorganic fluxes according to the content and degree of activation of halides in fluxes;Also included are the use of flux, materials containing flux, and low residual flux used in no-wash processes.
IPC/EIAJ-STD-005
Solder paste specification requirement I includes appendix I.The characteristics and technical requirements of solder paste are listed, as well as test methods and metal content standards, as well as viscosity, collapse, solder ball, viscosity and solder stick properties of solder paste.
IPC/EIAJ-STD-006A
Specification requirements for electronic grade solder alloys, flux and non-flux solid solder.For electronic grade solder alloys, for rod, strip, powder and non-flux solder, for electronic solder applications, for special electronic grade solder terminology, specification requirements and test methods.
IPC-CA-821
General requirements for thermal binder.Includes requirements and test methods for attaching components to conductive dielectrics in suitable locations.
IPC-3406
Guide for conductive surface coating adhesives.Provides guidance for the selection of conductive binder as an alternative solder in electronic manufacturing.
IPC-AJ-820
Assembly and welding manual.Contains a description of inspection techniques for assembly and welding, including terms and definitions;Printed circuit boards, types of components and pins, materials for welding points, standard reference and outline for installation and design of components;Welding technology and packaging;Cleaning and film covering;Quality assurance and testing.
IPC-7530
Guide to temperature curves for batch welding processes (reflow and wave soldering).Various test methods, techniques and methods are used in temperature curve acquisition to provide guidance for establishing the best graph.
IPC-TR-460A
Troubleshooting list of wave crest welding of printed circuit board.A list of recommended corrective actions for faults that may be caused by wave soldering.
IPC/EIA/JEDECJ-STD-003A
Solderability test of printed circuit board.
J-STD-013
The application of pin lattice array (SGA) and other high density technology.Establish the specification requirements and interactions required for the PCB packaging process to provide information for high performance and high number of pins integrated circuit packaging interconnection, including design principles information, material selection, board manufacturing and assembly techniques, test methods, and reliability expectations based on the end use environment.
IPC-7095
SGA device design and assembly process supplement.Provide useful operational information for people who are using SGA devices or are considering switching to array encapsulation;Provide guidance for SGA testing and maintenance and provide reliable information on SGA field.
IPC-M-I08
Cleaning instruction manual.Includes the latest version of IPC cleaning instructions to assist manufacturing engineers in determining the cleaning process and troubleshooting of the product.
IPC-CH-65A
Instructions for cleaning printed circuit board assembly.Provides a reference to current and emerging cleaning methods in the electronics industry, including a description and discussion of various cleaning methods, and explains the relationship between various materials, processes and contaminants in manufacturing and assembly operations.
IPC-SC-60A
Solvent cleaning manual after welding.The application of solvent cleaning technology in automatic welding and manual welding is presented.
IPC-9201
Surface insulation resistance manual.Contains the terminology, theory, test procedures and test methods for surface insulation resistance (SIR), as well as temperature, humidity (TH) tests, fault modes and troubleshooting.
IPC-DRM-53
Electronic assembly desktop reference manual introduction.Diagrams and photographs used to illustrate through-hole mounting and surface mount assembly techniques.
IPC-M-103
Surface mount assembly manual standard.This section includes all 21 IPC files relating to surface mount.
IPC-M-I04
Printed circuit board assembly manual standard.Contains the 10 most widely used files on PCB assembly.
IPC-CC-830B
Properties and identification of electronic insulating compounds in printed circuit board assembly.The coating meets an industry standard for quality and qualification.
IPC-S-816
Process guide and list of surface mount technology.This troubleshooting guide lists all types of process problems encountered in surface mount assembly and their solutions, including bridging, missing welding, misaligned components, etc.
IPC-CM-770D
Installation guide for printed circuit board components.To provide effective guidance for the preparation of components in PCB assembly, and to review relevant standards, impact and distribution, including assembly techniques (manual and automatic as well as surface mount and flip chip assembly techniques) and consideration of subsequent welding, cleaning and lamination processes.
IPC-7129
Number of failures per million chance (DPMO) calculation and manufacturing index of printed circuit board assembly.For the calculation of defects and quality related industry agreed benchmark indicators;It provides a satisfactory method for calculating the benchmark number of failures per million opportunities.
IPC-9261
PCB assembly throughput estimates and failures per million opportunities during assembly.A reliable method for calculating the number of failures per million opportunities during the assembly of printed circuit boards is defined, which is the standard for evaluation at all stages of the assembly process.
IPC-D-279
Reliable surface mount technology printed circuit board assembly design guide.A guide to the reliability of manufacturing processes for surface mount and hybrid printed circuit boards, including design ideas.
IPC-2546
The assembly requirements of transfer points in PCB assembly.Material motion systems such as actuators and buffers, manual placement, automatic screen printing, binder automatic distribution, automatic surface mount placement, automatic through-hole placement, forced convection, infrared reflow furnace and wave soldering are described.
IPC-PE-740A
Trouble shooting in PCB manufacturing and assembly.Includes case records and calibration activities for problems occurring in the design, manufacture, assembly and testing of printed circuit products.
IPC-6010
Printed circuit board quality standards and performance specifications series manual.Includes quality standards and performance specifications for all printed circuit boards developed by the American printed circuit board association.
IPC-6018A
Inspection and test of microwave printed circuit board.Includes performance and qualification requirements for high frequency (microwave) printed circuit boards.
IPC-D-317A
Design guidelines for electronic packaging using high speed technology.Provides guidance for high-speed circuit design, including mechanical and electrical considerations and performance testing.